Touch display apparatus and method for fabricating the same

ABSTRACT

A method of fabricating a touch display apparatus is provided which includes: forming a first substrate on a first carrier; forming an assembly part on a second carrier, wherein the assembly part includes a second substrate, a third substrate and a touch sensing layer interposed therebetween, and the third substrate is relatively near a side of the second carrier; assembling the first substrate and the assembly part such that a display layer is formed between the first substrate and the assembly part; and at least removing the first carrier.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Division of U.S. patent application Ser. No.13/742,967, filed Jan. 16, 2013 and entitled “TOUCH DISPLAY APPARATUSAND METHOD FOR FABRICATING THE SAME”, now U.S. Pat. No. 9,207,790, whichclaims priority of Taiwan Patent Application No. 101102434, filed onJan. 20, 2012, the entirety of which is incorporated by referenceherein.

BACKGROUND

Field

The present invention relates to a touch display apparatus. Moreparticularly, the present invention relates to a touch display apparatushaving a reduced thickness with high alignment accuracy between a touchpanel and a display panel and a method of fabricating thereof.

Description of the Related Art

Conventional input devices, such as a keyboard or mouse, have beengradually replaced by touch devices for a convenient user interface. Thetouch device is capable of being mounted on various flat displayapparatuses such that the touch and display functions can besimultaneously implemented on a touch display apparatus. Typically, thetouch panel is mounted on a liquid crystal panel or an OLED displaypanel, for apparatuses such as tablets or smart phones.

In the conventional method of fabricating a touch display apparatus, thedisplay panel and the touch panel are fabricated individually and thenadhere to each other. Thus, each of the display panel and the touchpanel needs an upper substrate and a lower substrate. These substratesare usually glass substrates having the disadvantages of being thick andheavy. The substrates of the display panel may be thinned by a thinningprocess after they are assembled to each other. However, the substratescan't be further thinned after the display panel and touch panel areassembled, and therefore the thickness of the touch display apparatuscannot be further reduced. In addition, both the upper and the lowersubstrates of the display panel would have an alignment mark, and theassembling of the upper and the lower substrates of the display panel byaligning the alignment marks has an alignment tolerance of less thanabout 5 μm. However, the dimensions of active areas of the display paneland the touch panel are different. The alignment marks used to align theupper and lower substrates of the display panel and the alignment marksused to align the upper and lower substrates of the touch panel are notoverlapped when assembling the display panel and the touch panel. Thus,an additional alignment mark for aligning the touch panel to the displaypanel is needed, and the assembling of the display panel and the touchpanel can only have an alignment tolerance of between around 70 and 80μm. Moreover, the yield would be significantly lowered and the costwould be increased when trying to reduce the alignment tolerance of theassembling of the display panel and the touch panel. Thus, theconventional method is not suitable for fabricating a touch displayapparatus having a high resolution display panel, in particular a 3Dtouch display apparatus.

Therefore, a touch display device capable of addressing the above issuesand a method of fabricating thereof are needed.

BRIEF SUMMARY

One object of the present invention is to provide a method offabricating a touch display apparatus, comprising: forming a firstsubstrate on a first carrier; forming an assembly part on a secondcarrier, wherein the assembly part comprises a second substrate, a thirdsubstrate and a touch sensing layer interposed therebetween, and thethird substrate is relatively near a side of the second carrier;assembling the first substrate and the assembly part such that a displaylayer is formed between the first substrate and the assembly part; andat least removing the first carrier.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will now be described, by way of example, with referenceto the accompanying drawings, in which:

FIGS. 1A and 1B show a top view and a cross-section view of a touchdisplay apparatus in accordance with an embodiment of the presentdisclosure, respectively.

FIGS. 2A to 2E illustrate a method of fabricating a touch displayapparatus including a liquid crystal panel in accordance with anembodiment of the present disclosure.

FIGS. 3A to 3D illustrate a method of fabricating a touch displayapparatus including a liquid crystal panel in accordance with anotherembodiment of the present disclosure.

FIGS. 4A to 4F illustrate a method of fabricating a touch displayapparatus including an OLED panel in accordance with an embodiment ofthe present disclosure.

FIGS. 5A to 5D illustrate a method of fabricating a touch displayapparatus including an OLED panel in accordance with another embodimentof the present disclosure.

DETAILED DESCRIPTION

A touch display apparatus having a reduced thickness with high alignmentaccuracy between a touch panel and a display panel and a method offabricating thereof in accordance with one or more embodiments of thepresent disclosure are provided.

FIGS. 1A and 1B show a top view and a cross-section view of a touchdisplay apparatus in accordance with an embodiment of the presentdisclosure, respectively. Referring to FIG. 1A, the touch displayapparatus may comprise a touch display area 100A and a peripheral area100B. Touch and display features may be formed in the touch display area100A. Signal transmission traces and opaque masks may be formed in theperipheral area 100B. A physical button, if needed, may be formed in theperipheral area 100. The touch display area 100A and the peripheral area100B may be covered by a protection covering for being touched by theuser. FIG. 1B shows a cross-section view along the section X-X′ shown inFIG. 1A. The touch display apparatus may comprise a display panel 101Aand a touch panel 101B using a common substrate. For example, as shownin FIG. 1B, the touch display apparatus may comprise a first substrate102, a second substrate 106 and a third substrate 110, and the secondsubstrate 106 is the common substrate of the display panel 101A and thetouch panel 101B. The display panel 101A may comprise the firstsubstrate 102, the second substrate 106 and a display layer 120interposed therebetween for imaging. The touch panel 101B may comprisethe second substrate 106, a third substrate 110 and a touch sensinglayer 130 interposed therebetween for sensing input information from theoutside. The touch display apparatus may further comprise a protectionlayer 150, such as the protection covering, disposed on the touch panel101B for sufficiently sealing and physically protecting the displaypanel 101A and the touch panel 101B.

The first substrate 102 may be a lower substrate of the display panel101A. The display layer 120 may comprise a liquid crystal layer or anorganic light emitting diode (OLED) array. The first substrate 102 maybe an array substrate which includes a glass substrate 103 with a pixelarray 104 formed thereon. The glass substrate 103 may be an ultra-thinglass substrate and have a thickness of less than about 0.3 mm, orpreferably less than about 0.1 mm. The pixel array 104 may be an activepixel array or a passive pixel array associated with the liquid crystallayer or the OLED array in the display layer 120. In addition, the pixelarray may comprise a first alignment mark (not shown).

The second substrate 106 may be disposed on the display layer 120. Thesecond substrate 106 may comprise a glass substrate 107 and optionallyfurther comprises a color filter 108 formed between the glass substrate107 and the display layer 120. The glass substrate 107 may be anultra-thin glass substrate having a thickness of less than about 0.3 mm,or preferably less than about 0.1 mm. The color filter 108 may comprisea red color filter, a blue color filter, a green color filter and ablack matrix interposed between the color filters of different colors.As described above, the second substrate 106 may be a common substrateof the display panel 101A and the touch panel 101B.

The touch sensing layer 130 may be disposed on the second substrate 106and include a patterned sensing electrode and a second alignment mark(not shown). The second alignment mark may be substantially aligned tothe first alignment mark with an alignment tolerance of less than about5 μm. The patterned sensing electrode may comprise a plurality ofsensing electrodes arranged in rows and lines in the touch display area.Each of the sensing electrodes may be surrounded by, for example, fouradjacent sensing electrodes. The sensing electrodes may be formed ofindium tin oxide (ITO), zinc indium oxide, tin cadmium oxide, zincaluminum oxide, zinc tin indium oxide, zinc oxide, cadmium oxide,hafnium oxide, indium gallium zinc oxide, indium gallium zinc magnesiumoxide, indium gallium magnesium oxide or indium gallium aluminum oxide.In an embodiment, the sensing electrodes may be the ITO due to its hightransparency to visible light, for example, higher than 90%. Note thatsince the second alignment mark in the touch sensing layer 130 isdirectly aligned to the first alignment mark in the first substrate 102,there is no need of an alignment mark in the second substrate 106.

The third substrate 110 acting as the upper substrate of the touch panel101B may be disposed on the touch sensing layer 130. The third substrate110 may comprise a glass substrate or an organic film such as apolyimide film or a polyethylene terephthalate (PET) film. The thirdsubstrate 110 may have a thickness of less than about 0.3 mm.

A polarizer 140 may be optionally disposed on an opposite side of thefirst substrate 102 in contrast to the display layer 120 and/or anopposite side of the third substrate 110 in contrast to the touchsensing layer 130. The protection layer 150 may be directly disposed onthe third substrate 110 or on the polarizer 140 for providing sufficientphysical protection to the display panel 101A and the touch panel 101B.

In accordance with one or more embodiments of the present disclosure,since the second substrate 106 is commonly used by the display panel101A and the touch panel 101B while the glass substrates 103, 107 of thefirst substrate 102 and second substrate 106 are ultra-thin (less than0.1 mm), the touch display panel apparatus could have a reducedthickness and weight. For example, the touch display apparatus may havea total thickness of less than 0.6 mm. The display panel 101A and thetouch panel 101B may have a total thickness of less than about 0.3 mmwhen eliminating the protection layer 150.

FIGS. 2A to 2E illustrate a method of fabricating a touch displayapparatus including a liquid crystal panel in accordance with anembodiment of the present disclosure. In this embodiment, the samereference numerals represent similar or same features with precedingembodiments.

First, referring to FIG. 2A, a first substrate 202 is formed on a firstcarrier 270. The first substrate 202 may comprise a glass substrate 203with a pixel array 204 formed thereon. In an embodiment, the glasssubstrate 203 may be an ultra-thin substrate having a thickness of lessthan about 0.1 mm. Alternatively, the glass substrate 203 may be normalglass which is thinned to have a thickness of less than about 0.3 mm bya thinning process. The thinning process may be a physical thinningmethod such as grinding or a chemical thinning method such as etching.The first carrier 270 may be a glass substrate having a sufficientmechanical support.

A pixel array 204 may be formed on the glass substrate 203 and form anactive array substrate with the glass substrate 203. The pixel array 204may comprise a plurality of pixels defined by a plurality of gate linesand data lines crossing each other. Each pixel may have a thin-filmtransistor (TFT). Each TFT may comprise a gate electrode electricallyconnected to the gate line and source/drain regions electricallyconnected to the data line for turning the pixel on or off. In addition,the pixel array 204 may further comprise a first alignment mark forbeing aligned by the touch panel. The first alignment mark may bedisposed outside the pixel area, such as on any edges or corners. In anembodiment, the first alignment mark may be disposed on the peripheralarea as shown in FIG. 1B. The first alignment mark may comprise a shapeof rectangular, circle, triangle, oblong, other polygons, other suitableshapes, or combinations thereof. In order to simplify the Figure toclarify, as shown in FIG. 2A, only a flattened layer is represented asthe pixel array 204.

Then, referring to FIG. 2B, an assembly part is formed on a secondcarrier 280. The assembly part may be a touch panel 201B. The touchpanel 201B may comprise a third substrate 210, a second substrate 206and a touch sensing layer 230 interposed therebetween. The thirdsubstrate 210 may be relatively near the second carrier 280, and thesecond substrate 206 may be relatively far away from the second carrier280. In addition, the third substrate 210 may have a second alignmentmark. The second carrier 280 may be a glass substrate having sufficientmechanical support. The third substrate 210 may be a glass substrate oran organic film such as a polyimide film or a polyethylene terephthalate(PET) film. The third substrate 210 may have a thickness of less thanabout 0.3 mm. The third substrate 210 may be formed on the secondcarrier 280 using a depositing or adhering method. The touch sensinglayer 230 may comprise a sensing area (i.e., the sensing area shown inFIG. 1A) and a peripheral area surrounding the sensing area (i.e., theperipheral area shown in FIG. 1B). The sensing area may comprise aplurality of sensing electrodes arranged in rows and lines and formed ofindium tin oxide (ITO), zinc indium oxide, tin cadmium oxide, zincaluminum oxide, zinc tin indium oxide, zinc oxide, cadmium oxide,hafnium oxide, indium gallium zinc oxide, indium gallium zinc magnesiumoxide, indium gallium magnesium oxide or indium gallium aluminum oxide.In an embodiment, the sensing electrode may be the ITO. Note that, in anembodiment, since the second alignment mark is provided for beingaligned by the first alignment mark, the second alignment mark may havethe same size and shape with those of the first alignment mark. In orderto simplify the Figure to clarify, as shown in FIG. 2B, only a flattenedlayer is represented as the touch sensing layer 230.

Then, referring to FIG. 2C, the first alignment mark and the secondalignment mark are aligned to each other for assembling the firstsubstrate and the assembly part. The second substrate 206 may beassembled onto the first substrate 202 with forming a display layer 220therebetween, and a liquid crystal display panel 201A is formed. Forexample, in this embodiment, the first substrate 202 and the secondsubstrate 206 may have a gap therebetween after they are assembled toeach other such that a liquid crystal material may be injected into thegap to form the liquid crystal display layer 220. In an embodiment, adam (not shown) may be used to space apart the first substrate 202 andthe second substrate 206. The liquid crystal material may be any liquidcrystal materials produced by known art. Since the second substrate 206is directly disposed on the touch sensing layer 230 and is capable ofacting as the upper substrate of the display panel 201A, the secondalignment mark in the touch sensing layer 230 may directly align to thefirst alignment mark in the pixel array 204. Thus, one or more aligningprocesses (e.g., aligning the color filter to the pixel array) could beeliminated when compared to the conventional adhering process. Inaddition, the alignment of the first alignment mark and the secondalignment mark is similar to the alignment of the upper and lowersubstrates of the liquid crystal display panel, and therefore it wouldhave an alignment tolerance of less than about 5 μm.

Then, referring to FIG. 2D, the first carrier 270 and the second carrier280 are removed. In an embodiment, the first and second carriers 270 and280 may be removed using a mechanical or chemical method. Finally,referring to FIG. 2E, a polarizer 240 is optionally adhered onto anopposite side of the first substrate 202 in contrast to display layer220 and/or an opposite side of the third substrate 210 in contrast tothe touch sensing layer 230. A protection layer 250 may be adhered ontothe polarizer 240 on the third substrate 210 for providing sufficientphysical protection to the liquid crystal display panel 201A and thetouch panel 201B. The protection layer 250 may be a toughened glasswhich has a thickness of between about 0.3 mm and 0.5 mm and is hardenough to protect the layers below.

FIGS. 3A to 3D illustrate a method of fabricating a touch displayapparatus including a liquid crystal panel in accordance with anotherembodiment of the present disclosure. In this embodiment, the secondcarrier may act as the protection layer. The same reference numeralsrepresent similar or same features with preceding embodiments.

First, referring to FIG. 3A, a first carrier 270 and a first substrate202 as shown in FIG. 2A are provided. The first substrate 202 maycomprise a glass substrate 203 with a pixel array 204 formed thereon.Then, referring to FIG. 3B, an assembly part is disposed on the secondcarrier 380. The touch panel 201B may comprise a third substrate 210, asecond substrate 206 and a touch sensing layer 230 interposedtherebetween. The third substrate 210 may be relatively near the secondcarrier 380, and the second substrate 206 may be relatively far awayfrom the second carrier 380. In addition, the third substrate 210 mayhave a second alignment mark. The second carrier 380 may be toughenedglass having a thickness of between 0.3 mm and 0.5 mm and a sufficienthardness for acting as a protection covering to protect other featuresof the touch display apparatus. In addition, a polarizer 240 may beoptionally adhered to the second carrier 380 before the disposition ofthe third substrate 210, the touch sensing layer 230 and the secondsubstrate 206. The touch sensing layer 230 may comprise a sensing area(i.e., the sensing area shown in FIG. 1A) and a peripheral areasurrounding the sensing area (i.e., the peripheral area shown in FIG.1B). Sensing electrodes may be formed in the sensing area, and a firstalignment mark may be formed in the peripheral area. The secondsubstrate 206 may be directly disposed on the touch sensing layer 230and may act as the common substrate of the touch panel 201B and thedisplay panel 201A. The second substrate 206 may comprise a glasssubstrate 207 with a color filter 208 formed thereon.

Then, referring to FIG. 3C, the first substrate 202 and the assemblypart are assembled by aligning the first alignment mark and the secondalignment mark to each other. For example, the second substrate 206 maybe assembled onto the first substrate 202 by forming a display layer 220therebetween, and a liquid crystal display panel 201A is formed. In thisembodiment, the first substrate 202 and the second substrate 206 mayhave a gap therebetween after they are assembled to each other such thata liquid crystal material could be injected into the gap to form theliquid crystal display layer 220. Similar with the precedingembodiments, the second alignment mark in the touch sensing layer 230may directly align to the first alignment mark in the pixel array 204,and therefore one or more aligning processes (e.g., aligning the colorfilter to the pixel array) could be eliminated when compared to theconventional adhering process. In addition, the alignment of the firstalignment mark and the second alignment mark is similar to the alignmentof the upper and lower substrates of the liquid crystal panel, andtherefore it would have an alignment tolerance of less than about 5 μm.

FIGS. 4A to 4F illustrate a method of fabricating a touch displayapparatus including an OLED panel in accordance with an embodiment ofthe present disclosure. In this embodiment, the display panel is an OLEDdisplay panel. The same reference numerals represent similar or samefeatures with preceding embodiments.

First, referring to FIG. 4A, a first substrate 402 is formed on a firstcarrier 470. The first substrate 402 may comprise a glass substrate 403with a pixel array 404 formed thereon. In an embodiment, the glasssubstrate 403 may comprise an ultra-thin glass having a thickness ofless than 0.1 mm. In another embodiment, the glass substrate 403 may bea normal glass which is thinned to have a thickness of less than 0.3 mmby a thinning process. The thinning process may be a physical thinningmethod such as grinding or a chemical thinning method such as etching.The first carrier 470 may be a glass substrate having a sufficientmechanical support.

The pixel array 404 may be an active pixel array or a passive pixelarray which forms an active pixel substrate or a passive pixel substratewith the glass substrate 403. The pixel array 404 may comprise aplurality of pixels. In the active pixel substrate, each pixel may haveat least one TFT for receiving data signals and scanning signals andturn on/off the pixels. In addition, the pixel array 404 may furthercomprise a first alignment mark (not shown). The first alignment markmay be disposed outside from the pixel areas, such as on any edges orcorners, for being aligned with the touch panel. In an embodiment, thefirst alignment mark may comprise a shape of rectangular, circle,triangle, oblong, other polygons, other suitable shapes, or combinationsthereof. In order to simplify the Figure to clarify, as shown in FIG.4A, only a flattened layer is represented as the pixel array 404.

Referring to FIG. 4B, an OLED display layer 420 may be formed on thepixel array 404. The OLED display layer 420 may be an OLED array. TheOLED array may comprise a plurality of OLEDs emitting white light, UVlight or red/blue/green lights. The OLED may be any OLEDs produced byknown art. For example, each OLED may comprise an electron injectinglayer, an electron transporting layer, an organic emitting layer, a holeinjecting layer, etc.

Then, referring to FIG. 4C, an assembled part is disposed on a secondcarrier 480. The assembly part may be a touch panel 401B. The touchpanel 401B may comprise a third substrate 410, a second substrate 406and a touch sensing layer 430 interposed therebetween. The thirdsubstrate 410 may be relatively near the second carrier 480, and thesecond substrate 406 may be relatively far away from the second carrier480. In addition, the third substrate 410 may have a second alignmentmark. The second carrier 480 may be a glass substrate having sufficientmechanical support. The third substrate 410 may be a glass substrate oran organic film, such as a polyimide film or a polyethyleneterephthalate (PET) film. The third substrate 410 may have a thicknessof less than about 0.3 mm. The third substrate 410 may be formed on thesecond carrier 480 using a depositing or adhering method. The touchsensing layer 430 may comprise a sensing area (i.e., the sensing areashown in FIG. 1A) and a peripheral area surrounding the sensing area(i.e., the peripheral area shown in FIG. 1B). The sensing area maycomprise a plurality of sensing electrodes arranged in rows and lines.The sensing electrodes may be formed of indium tin oxide (ITO), zincindium oxide, tin cadmium oxide, zinc aluminum oxide, zinc tin indiumoxide, zinc oxide, cadmium oxide, hafnium oxide, indium gallium zincoxide, indium gallium zinc magnesium oxide, indium gallium magnesiumoxide or indium gallium aluminum oxide. In an embodiment, the sensingelectrodes may be the ITO. Note that in an embodiment, since the secondalignment mark may be provided for the alignment of the first alignmentmark, the second alignment mark may have the same size and shape withthose of the first alignment mark. In order to simplify the Figure toclarify, as shown in FIG. 4C, only a flattened layer is represented asthe touch sensing layer 430.

The second substrate 406 may be a transparent glass substrate 407 or asubstrate 407 with a color filter 408 formed thereon. The secondsubstrate 406 may be a common substrate of the touch panel 401B and theOLED display panel 401A. For example, the second substrate 406 may actas both the lower substrate of the touch panel 401B and the uppersubstrate of the OLED display panel 401A. The glass substrate may be anultra-thin glass having a thickness of less than about 0.1 mm.Alternatively, the glass substrate 407 may be a normal glass which isthinned to have a thickness of less than 0.3 mm by a thinning process.The thinning process may be a physical thinning method such as grindingor a chemical thinning method such as etching. Note that whether thesecond substrate includes the color filter 408 or not, there is no needto form an alignment mark in the second substrate.

Then, referring to FIG. 4D, the first substrate and the assembly partare assembled by aligning the first alignment mark and the secondalignment mark to each other. For example, the second substrate 406 isassembled onto the first substrate 402, and the OLED display panel 401Aand the touch panel 401B are formed. In this embodiment, the secondsubstrate 406 may be directly adhered to the OLED display layer 420. Itshould be noted that since the second substrate 406 is directly disposedon the touch sensing layer 430 and acts as the upper substrate of theOLED display panel 401A, the second alignment mark in the touch sensinglayer 430 may directly align to the first alignment mark in the pixelarray 404. Thus, one or more aligning processes (e.g., aligning thecolor filter to the pixel array) could be eliminated when compared tothe conventional adhering process. In addition, the alignment of thefirst alignment mark and the second alignment mark is similar to thealignment of the upper and lower substrates of the OLED display panel,and therefore it would have an alignment tolerance of less than about 5μm.

Then, referring to FIG. 4E, the first carrier 470 and the second carrier480 are removed. In an embodiment, the first and the second carriers 470and 480 may be removed using mechanical or chemical methods. Finally,referring to FIG. 4F, a polarizer 440 is optionally adhered onto anopposite side of the first substrate 402 in contrast to polarizer 440and/or an opposite side of the third substrate 410 in contrast to thetouch sensing layer 430. A protection layer 450 may be adhered onto thepolarizer 440 on the third substrate 410 for providing sufficientphysical protection to the OLED display panel 401A and the touch panel401B. The protection layer 450 may be toughened glass which has athickness of between about 0.3 mm and 0.5 mm and is hard enough toprotect the layers below.

FIGS. 5A to 5E illustrate a method of fabricating a touch displayapparatus including an OLED panel in accordance with another embodimentof the present disclosure. In this embodiment, the second carrier mayact as the protection layer. The same reference numerals representsimilar or same features with preceding embodiments.

First, referring to FIG. 5A, a first carrier 470 and a substrate 402 asshown in FIG. 4A are provided. The first substrate 402 may comprise aglass substrate 403 with a pixel array 404 formed thereon. The OLEDdisplay layer 420 may comprise an OLED array disposed on the firstsubstrate 402. Then, referring to FIG. 5B, an assembly part is disposedon the second carrier 580. The assembly part may be a touch panel 401B.The touch panel 401B may comprise a third substrate 410, a secondsubstrate 406 and a touch sensing layer 430 interposed therebetween. Thethird substrate 410 may be relatively near the second carrier 580, andthe second substrate 406 may be relatively far away from the secondcarrier 580. In addition, the third substrate 410 may have a secondalignment mark. Note that the second carrier 580 may be toughened glassfor acting as a protection covering of the touch display apparatus. Thesecond carrier 580 may have a thickness of between 0.3 mm and 0.5 mm andhave a sufficient hardness to protect other features. The touch sensinglayer 430 may comprise a sensing area (i.e., the sensing area shown inFIG. 1A) and a peripheral area surrounding the sensing area (i.e., theperipheral area shown in FIG. 1B). Sensing electrodes may be formed inthe sensing area and a first alignment mark is formed in the peripheralarea (not shown). The second substrate may be a transparent glasssubstrate 407 or a glass substrate 407 having a color filter 408 formedthereon. The second substrate 406 may be directly disposed on the touchsensing layer 430 and act as the common substrate of the touch panel andthe display panel.

Then, referring to FIG. 5C, the first substrate and the assembly partare assembled by aligning the first alignment mark and the secondalignment mark to each other. For example, the second substrate 406 isassembled onto the first substrate 402, and the display panel 401A andthe touch panel 401B are formed. In an embodiment in which the secondsubstrate 406 does not include the color filter, the glass substrate 407is directly adhered to the OLED display layer 420. In an embodiment inwhich the second substrate 406 includes the color filter, the colorfilter 408 is directly adhered to the OLED display layer 420. It shouldbe noted that since the second substrate 406 is directly disposed on thetouch sensing layer 430 and acts as the upper substrate of the OLEDdisplay panel 401A, the second alignment mark in the touch sensing layer430 may directly align to the first alignment mark in the pixel array404. Thus, one or more aligning processes (e.g., aligning the colorfilter to the pixel array) could be eliminated when compared to theconventional adhering process. In addition, the alignment of the firstalignment mark and the second alignment mark is similar to the alignmentof the upper and lower substrates of the liquid crystal panel, andtherefore it would have an alignment tolerance of less than about 5 μm.

Then, referring to FIG. 5D, the first carrier 470 is removed. The secondcarrier 580 remains to act as a protective layer. The first carrier 470may be removed by a mechanical or chemical method.

While the preferred embodiments of the invention have been describedabove, it will be recognized and understood that various modificationscan be made to the invention and the appended claims are intended tocover all such modifications which may fall within the spirit and scopeof the invention.

What is claimed is:
 1. A method of fabricating a touch displayapparatus, comprising: providing a first substrate, wherein the firstsubstrate comprises a first alignment mark; providing an assembly part,wherein the assembly part comprises a second substrate, a thirdsubstrate and a touch sensing layer interposed therebetween, and thesecond substrate is between the first substrate and the third substrate,wherein the third substrate comprises a second alignment mark, and thesecond substrate does not comprise an alignment mark; and assembling thefirst substrate and the assembly part such that a display layer isformed between the first substrate and the assembly part.
 2. The methodaccording to claim 1, further comprising: forming a toughened glass onthe third substrate.
 3. The method according to claim 1, wherein atleast one of the first, the second and the third substrates has athickness of less than 0.3 mm.
 4. The method according to claim 1,wherein at least one of the first, the second and the third substrateshas a thickness of less than 0.1 mm.
 5. The method according to claim 1,wherein at least one of the first, the second and the third substratesis a glass substrate.
 6. The method according to claim 1, wherein thedisplay layer comprises a liquid crystal layer or an OLED array.
 7. Themethod according to claim 1, wherein the first alignment mark comprisesa shape of a rectangle, circle, triangle, oblong, other polygons orcombinations thereof.
 8. The method according to claim 1, wherein thefirst alignment mark and the second alignment mark have the same sizeand the same shape.